Fluxless Soldering in Activated Hydrogen Atmosphere
نویسندگان
چکیده
ABSTRACT A novel hydrogen activation technology based on activated or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal temperature. The the potential to be used several applications in electronics packaging industry. Recent work from a joint effort between Air Products Sikama International alpha trials of production-scale furnace flux-free wafer bump reflow Electron Attachment is also discussed.
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ژورنال
عنوان ژورنال: Proceedings of the ... International Symposium on Microelectronics
سال: 2021
ISSN: ['1085-8024']
DOI: https://doi.org/10.4071/1085-8024-2021.1.000080